ELECTRONICS & PCB INSPECTION
See Hidden Defects in Electronics and PCBs with Industrial CT
Non-destructive 3D CT reveals internal layers, solder joints, vias, and BGAs.
Find voids, cracks, misalignments, and hidden rework across complete assemblies.
Quantified results and clear visuals accelerate failure analysis and quality decisions.
Inside Electronics
Our high-resolution CT systems reveal the internal architecture of electronics—layer stack, copper traces, vias, and solder joints—without cutting the board.
The 3D volume exposes hidden defects such as voids, cracks, bridges, or misalignment and quantifies solder volume and porosity.
Ideal for PCBA validation, failure analysis, and process control.
Radiography Board Inspection
Our 2D X-ray inspection provides fast, non-destructive views of PCAs and ECUs. In real time we detect solder defects (bridges, voids, opens), bond-wire damage, foreign objects, and misplacements—also beneath BGA/QFN via oblique imaging. Ideal for incoming inspection, inline screening, and failure analysis.
Falknis Inspect
Our in-house software analyzes BGA and QFN solder joints from 2D X-ray and 3D CT. It auto-detects balls/pads, segments voids, and computes the void percentages with configurable IPC limits. Batch processing ensures repeatable results. With one click, it generates structured inspection reports including a summary, per-ball table, screenshots, and statistics.
MEHR
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